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CAPILLARY

BONDING CAPILLARY

MEGA-AP CAPILLARY

MEGA-Cu CAPILLARY

CERAMIC PARTS

자동화장비
CPM is a suitable capillary for a fine-pitch bonding.
It is manufactured by optimized sintering process and combination between alumina and zirconia.


We provide various tip finish solution to meet customer needs on wire bonding process.
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Material Property
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Feature
- Various finish tip solution
-Excellent bond-ability and long life span
-High productivity
Tip Finish solution
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